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D-Sub高容重聯接器AMPHENOL

上傳的時間：2023-09-06 16:40:00     訪問：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高(gao)強度鏈(lian)接(jie)器圓角PCB線接(jie)有幾種打包封裝(zhuang)戰(zhan)略布局經典款(kuan)：德國規劃和軍(jun)工行(xing)業用戰(zhan)略布局。套(tao)裝(zhuang)配(pei)(pei)搭版塊接(jie)觸性從表面始終如(ru)一為金燦色(se)，能(neng)要根據需提交(jiao)要的(de)很足(zu)套(tao)裝(zhuang)配(pei)(pei)搭頻(pin)次首選六種最基本板(ban)厚(hou)：閃光(guang)彈金、15μ"和30μ"。觸碰點(dian)都可以(yi)出(chu)(chu)具精(jing)密生產機器生產的(de)軍(jun)工企業用級板(ban)本（特殊直(zhi)流電壓高(gao)至7.5A）以(yi)保障(zhang)機制衛(wei)生不靠譜(pu)性，還能(neng)夠(gou)出(chu)(chu)具更第三產業且(qie)可商(shang)用廚房的(de)額定值瞬時電流為3A的(de)沖壓加工固件版本。

D-Sub密(mi)度高(gao)計算對接器(qi)基準題(ti)材常從A到E的(de)(de)(de)5種根本外殼要(yao)求，AMPHENOL的(de)(de)(de)分(fen)層(ceng)連結器(qi)在(zai)數據顯示數據、電源(yuan)適配器(qi)和(he)同軸拖鏈(lian)電纜角度都具有自由高(gao)達(da)18個(ge)碰到點的(de)(de)(de)分(fen)布。堆疊(die)（雙表層(ceng)）D-Sub高(gao)孔(kong)隙(xi)率(lv)接觸器(qi)好產品一系列相當的(de)(de)(de)高(gao)。AMPHENOL新開通發的(de)(de)(de)用來(lai)作為PIP激光焊接細長（或沉(chen)式(shi)或短(duan)型）系類在(zai)AMPHENOL的(de)(de)(de)商業區的(de)(de)(de)客戶中(zhong)獲(huo)得了順利完成。除(chu)此以外，AMPHENOL還(huan)行為擁有用帶來(lai)系統，其中(zhong)包含黑色(se)金屬蓋(gai)、氟塑(su)料(liao)除(chu)塵蓋(gai)、保(bao)護的(de)(de)(de)罩、裝配系統、兩性改變和(he)多種更換器(qi)。

的特點

原則D形相接插件

EMI輕金屬外層

插座一定接地設備(bei)凹坑

插進去(qu)件(jian)由耐油熱固性變(bian)形可塑料做而成

應該(gai)用商(shang)務(wu)單位公章(zhang)排斥(chi)點(dian)

必備條(tiao)件全方向位置線(xian)接規模的變體

各式各樣線接規(gui)格(ge)參數(shu)均(jun)展示 電插座和電源(yuan)插頭(tou)

競爭優勢

確認正確合(he)理的結合(he)定位

關鍵代替(ti)批處(chu)理工作但減輕利潤的化解實施方案

UL#E232356證書

兼容種種粉絲需求量

達到標準標準標準

特俗(su)編(bian)適(shi)用于管腳焊(han)錫膏或分流焊(han)結

佛山市(shi)立維創(chuang)(chuang)展(zhan)信息技術(shu)代(dai)理加盟供應商AMPHENOL裝(zhuang)修公司多個范圍新(xin)產品系統(tong)，在AMPHENOL，AMPHENOL信自己在組(zu)織開展(zhan)相關業(ye)務的(de)(de)(de)(de)(de)進程中(zhong)做(zuo)到可不(bu)(bu)間斷(duan)不(bu)(bu)斷(duan)的(de)(de)(de)(de)(de)選用能為自然人股東造就短期(qi)貸款和繼續價值觀。AMPHENOL的(de)(de)(de)(de)(de)企業(ye)每一(yi)個項業(ye)務領域都銳意創(chuang)(chuang)新(xin)于不(bu)(bu)間斷(duan)改善其設置，銷售，研發(fa)和交貨成品的(de)(de)(de)(de)(de)方(fang)(fang)試，認(ren)真實現(xian)或趕超老客(ke)戶對一(yi)整個顏(yan)值鏈中(zhong)成品方(fang)(fang)法(fa)的(de)(de)(de)(de)(de)概(gai)率。AMPHENOL 的(de)(de)(de)(de)(de)業(ye)務流程將的(de)(de)(de)(de)(de)安全和環保保護性對于首先(xian)是目標(biao)，并表明ISO 14001和OHSAS 18001等全球公認(ren)標(biao)菅理某些計劃方(fang)(fang)案。可，注(zhu)冊和國家法(fa)律(lv)合法(fa)合法(fa)性還跟(gen)不(bu)(bu)上。AMPHENOL往往僅自覺遵守相關法(fa)律(lv)法(fa)規就能創(chuang)(chuang)作繼續幣值。

內容了解AMPHENOL可(ke)點(dian)擊：//dev.www.zb5858.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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